Press to Clamp, Open Instantly: No repeated knob turning. One press to lock, one touch to release. Faster operation, less fatigue.
Built-in Spring Mechanism: Maintains steady pressure during heating. Keeps the chip stable when removing glue with hot air. Reduces shifting and misalignment.
Solid Metal Construction: Rugged frame + precision clamp. Anti-rust and anti-deformation. Withstands flux, solder, and heat from daily repair work.
Heat-Resistant Panel: Synthetic stone base protects your workbench. Secures chips safely during hot-air glue removal.
Max Clamping Size: 18.5mm: Compatible with a wide range of ICs: BGA Chips, QFN Chips, CPU Chips, NAND Flash, EMMC Chips, and Other standard IC chips
Precise Positioning: Accurate chip alignment for better solder joints and cleaner rework results.
