Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK 6582 MSM8916 8917 8909 8939 8953 8940 Kirin 665 659 The 3D feature of the Qianli Toolplus stencil makes fixing your chip much easier and 100% accurate. Enabling you to work faster and perform a perfectly precise job every time you reball a chip using this stencil, Supports eMMC BGA chips and DDR memory chips.
